Following these critical steps early in the development phase of a new product will result in the following benefits for our clients:
Process qualification and First Article Inspection (FAI) benchmarking.
In cases where a PBA needs to be protected against extreme conditions potting or resin encapsulation is used to seal off the assembly. Typically a resin or polyurethane is used to encapsulate the product.
Omnigo is flexible and can adapt our processes for any client specification with regards to potting or encapsulation whether it is for a flexible or rigid or opaque or clear solution.
Omnigo has extensive experience in further integration of electronic PBA’s into mechanical housings or systems. We have an in-house design team that can also design a suitable solution to package your product into a mechanical assembly.
Omnigo also offers customised transformer and Coil winding facilities where off-the-shelf items are not readily available and for very specific applications that may have unique requirements.
Omnigo offers a specialised capability to re-ball and re-work Ball-Grid-Array’s. This is a requirement where BGA devices available for production might not suit the build method, i.e. Lead or Lead free.
Contact us right now to get a cost-effective quote tailored to your requirements
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